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Printed Circuit Assembly

  Time:2012-06-06 12:00

The electronic conponents must be attached to form a functional printed circuit assembly after the printed circuit board is compeled.This process is called PCA or PCBA.In through-hole construction,component leads are inserted in holes.In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB.

In both kinds of construction,component leads are electrically and mechanically fixed to the board with a molten metal solder. The techniques is variable to attach components to A PCB.High volume production is usually done with STM placement machine and bulk wave soldering or reflow ovens,but skilled technicians are able to solder very tiny parts by hand under a microscope,using tweezers and a fine tip soldering iron for small volume prototypes.Some parts may be extremely difficult to solder by hand,such as BGA packages.

Often, through-hole and surface -mount construction must be combined in a single assembly because some required components are available only in surface-mount packages,while others are available only in through-hole packages.Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress,while components that are expected to go untouched will take up less space using surface-mount techniques.

When the board has been populated it may be tested in avariety of ways:

while the power is off, visual inspection,automated optical inspection.JEDEC guidelines for PCB component placement,soldering,and inspection are commonly used to maintain quality control in this stage of PCB manufacturing. while the power is off,analog signature analysis,power-off testing.

while the power is on,in-circuit test,where physical measurements can be done. while the power is on, functional test,just checking if the PCB does what it had been designed to do. To facilitate these tests,PCBs may be designed with extra pads to make temporary connections.Sometimes these pads must be isolated with resistors.

The in-circuit test may also exercise boundary scan test features of some components.In-circuit test systems may also be used to program nonvolatile memory components on

the board. In boundary scan testing,test circuit integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standared test configuration procedure,the most common one being the joint Test Action Group(JTAG)standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various when boards fail the test,technicians may desolder and replace failed componants,a task known as rework.

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