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PCB clone

Materials for PCB manufacturing

  Time:2012-05-31 17:52

Conducting layers are typically made of thin copper foil. Insulating layers dielectric are

typically laminated together with epoxy resin prepreg. The board is typically coated with a

solder mask that is green in color. Other colors that are normally available are blue,

black, white and red. There are quite a few different dielectrics that can be chosen to

provide different insulating values depending on the requirements of the circuit. Some of

these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well

known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3

(Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6

(Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy),

CEM-2 (Cotton paper and epoxy), CEM-3 (Non-woven glass and epoxy), CEM-4 (Woven glass and

epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration

especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the

best dimensional stability.

FR-4 is by far the most common material used today. The board with copper on it is called

"copper-clad laminate".

Copper foil thickness can be specified in ounces per square foot or micrometres. One ounce

per square foot is 1.344 mils or 34 micrometres.