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  1. 1Break protect of chip TMS320F28
  2. 2TMS320F28332 mcu reverse
  3. 3Extract mcu dsPIC33FJ64GP708A H
  4. 4PIC16F1503 reverse engineering
  5. 5Extract mcu PIC12F1501 HEX or B
  6. 6Clone Microcontroller MCU M3062

TMS320F28332 mcu reverse

  Time:2017-12-06 17:34
My company can do TMS320F28332 mcu reverse
Beijing Shouxi Zhixin Technology specializing in single chip microcomputer (MCU), chip decryption, IC declassified, CPLD, Mcu Attack and  IC reverse analysis. (the company decryption legitimacy only). Our company has experienced technical personnel, in the process of single-chip decryption keep learning and research, has accumulated rich experience of decryption. Company since its establishment, in relying on advanced technology, excellent technical team and modern management experience won the general customers the consistent high praise, at the same time, also with the domestic big business enterprise of SCM cooperation, promote the communication and development of the single chip microcomputer technology. If you need to decrypt the chip, or PCB copy, please contact us.

Invasive attacks

Despite to more complexity of invasive attacks some of them could be done without using expensive laboratory equipment. Low-budget attackers are likely to get a cheaper solution on the second-hand market for semiconductor test equipment. With patience and skill it should not be too difficult to assemble all the required tools for even under ten thousand US dollars by buying a second-hand microscope and using self-designed micropositioners. The laser is not essential for first results, because vibrations in the probing needle can also be used to break holes into passivation.

Invasive attacks start with the removal of the chip package. Plastic over the chip could be removed by knife. Epoxy resin around the chip could be removed using fuming nitric acid. Hot fuming nitric acid dissolves the package without affecting the chip. The procedure should preferably be carried out under very dry conditions, as the presence of water could corrode exposed aluminium interconnects. The chip is then washed with acetone in an ultrasonic bath, followed optionally by a short bath in deionized water and isopropanol. After that chip could be glued into a test package and bonded manually. Having enough experience it might be possible to remove epoxy without destroying bonding wires and smartcard contacts.

Once the chip is opened it is possible to perform probing or modifying attacks. The most important tool for invasive attacks is a microprobing workstation. Its major component is a special optical microscope with a working distance of at least 8 mm between the chip surface and the objective lens. On a stable platform around a socket for the test package, we install several micropositioners , which allow us to move a probe arm with submicrometer precision over a chip surface. On this arm, we install a probe needle. These elastic probe hairs allow us to establish electrical contact with on-chip bus lines without damaging them.

On the depackaged chip, the top-layer aluminium interconnect lines are still covered by a passivation layer (usually silicon oxide or nitride), which protects the chip from the environment and ion migration. On top of this, we might also find a polyimide layer that was not entirely removed by HNO3 but which can be dissolved with ethylendiamine. We have to remove the passivation layer before the probes can establish contact. The most convenient depassivation technique is the use of a laser cutter. The UV or green laser is mounted on the camera port of the microscope and fires laser pulses through the microscope onto rectangular areas of the chip with micrometer precision. Carefully dosed laser flashes remove patches of the passivation layer. The resulting hole in the passivation layer can be made so small that only a single bus line is exposed. This prevents accidental contacts with neighboring lines and the hole also stabilizes the position of the probe and makes it less sensitive to vibrations and temperature changes.

It is usually not practical to read the information stored on a security processor directly out of each single memory cell, except for ROM. The stored data has to be accessed via the memory bus where all data is available at a single location. Microprobing is used to observe the entire bus and record the values in memory as they are accessed.

It is difficult to observe all (usually over 20) data and address bus lines at the same time. Various techniques can be used to get around this problem. For instance we can repeat the same transaction many times and use only two to four probes to observe various subsets of the bus lines. As long as the processor performs the same sequence of memory accesses each time, we can combine the recorded bus subset signals into a complete bus trace. Overlapping bus lines in the various recordings help us to synchronize them before they are combined.

In order to read all memory cells without the help of the card software, we have to abuse a CPU component as an address counter to access all memory cells for us. The program counter is already incremented automatically during every instruction cycle and used to read the next address, which makes it perfectly suited to serve us as an address sequence generator. We only have to prevent the processor from executing jump, call, or return instructions, which would disturb the program counter in its normal read sequence. Tiny modifications of the instruction decoder or program counter circuit, which can easily be performed by opening the right metal interconnect with a laser, often have the desired effect.

Another approach to understand how particular microcontroller or smartcard work is to reverse engineer it. The first step is to create a map of a new processor. It could be done by using an optical microscope with a CCD camera to produce several meter large mosaics of high-resolution photographs of the chip surface. Basic architecture structures, such as data and address bus lines, can be identified quite quickly by studying connectivity patterns and by tracing metal lines that cross clearly visible module boundaries (ROM, RAM, EEPROM, ALU, instruction decoder, etc.). All processing modules are usually connected to the main bus via easily recognizable latches and bus drivers. The attacker obviously has to be well familiar with CMOS VLSI design techniques and microcontroller architectures, but the necessary knowledge is easily available from numerous textbooks.

Photographs of the chip surface show the top metal layer, which is not transparent and therefore obscures the view on many structures below. Unless the oxide layers have been planarized, lower layers can still be recognized through the height variations that they cause in the covering layers. Deeper layers can only be recognized in a second series of photographs after the metal layers have been stripped off, which could be achieved by submerging the chip for a few seconds in hydrofluoric acid (HF) in an ultrasonic bath. HF quickly dissolves the silicon oxide around the metal tracks and detaches them from the chip surface. HF is an extremely dangerous substance and safety precautions have to be followed carefully when handling it.

Where the implementation is familiar, there are a number of ways to extract information from the chip by targeting specific gates or fuses or by overwriting specific memory locations. Even where this is not possible, memory cells can be attacked; this can also be done on a relatively modest budget.

Most currently available microcontrollers and smartcard processors have feature sizes of 0.5 - 1 µm and only two metal layers. These can be reverse-engineered and observed with the manual and optical techniques described in the previous sections. For future chip generations with more metal layers and features below the wavelength of visible light, more expensive tools additionally might have to be used.

A focused ion beam (FIB) workstation consists of a vacuum chamber with a particle gun, comparable to a scanning electron microscope (SEM). Gallium ions are accelerated and focused from a liquid metal cathode with 30 kV into a beam of down to 5 - 10 nm diameter, with beam currents ranging from 1 pA to 10 nA. FIBs can image samples from secondary particles similar to a SEM with down to 5 nm resolution. By increasing the beam current, chip material can be removed with the same resolution. Better etch rates can be achieved by injecting a gas like iodine via a needle that is brought to within a few hundred micrometers from the beam target. Gas molecules settle down on the chip surface and react with removed material to form a volatile compound that can be pumped away and is not redeposited. Using this gas-assisted etch technique, holes that are up to 12 times deeper than wide can be created at arbitrary angles to get access to deep metal layers without damaging nearby structures. By injecting a platinum-based organometallic gas that is broken down on the chip surface by the ion beam, platinum can be deposited to establish new contacts. With other gas chemistries, even insulators can be deposited to establish surface contacts to deep metal without contacting any covering layers.

Using laser interferometer stages, a FIB operator can navigate blindly on a chip surface with 0.15 µm precision, even if the chip has been planarized and has no recognizable surface structures. Chips can also be polished from the back side down to a thickness of just a few tens of micrometers. Using laser interferometer navigation or infrared laser imaging, it is then possible to locate individual transistors and contact them through the silicon substrate by FIB editing a suitable hole. This rear-access technique has probably not yet been used by pirates so far, but the technique is about to become much more commonly available and therefore has to be taken into account by designers of new security chips. FIBs are used by attackers today primarily to simplify manual probing of deep metal and polysilicon lines. A hole is drilled to the signal line of interest, filled with platinum to bring the signal to the surface, where a several micrometer large probing pad or cross is created to allow easy access. Modern FIB workstations (for example the FIB 200xP from FEI) cost less than half a million US$ and are available in over hundred organizations. Processing time can be rented from numerous companies all over the world for a few hundred dollars per hour.