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About PCB drawing (CAM) operation process

  Time:2017-10-18 10:35
(1) check the user's file
For user files, first to conduct routine checks
1, check whether the disk file is intact;
2, check whether the file with *, * * must first kill *;
3, if the Gerber file is checked for D code or D code contains.
(2) check whether the design conforms to the process level of our factory
1, check whether the design of the customer file spacing is in line with the process of the factory: the line and line spacing between the line and the pad between the pad and pad spacing. The above spacing should be greater than the minimum distance that can be achieved by the production process.
2, check the width of the wire, requiring the width of the wire should be greater than the smallest production process can achieve
3, check the size of the through hole to ensure the minimum pore size of the production process.
4, check the size of the pad and its internal bore, so as to ensure the width of the pad edge after drilling.
(3) determine the process requirements
Various process parameters are determined according to user requirements.
Process requirement:
1, the different requirements of the subsequent process, to determine whether the photo negative film (commonly known as film) mirror. The film mirror principle: the membrane surface (i.e., ^^^ rubber surface) paste the membrane surface to reduce the error. The decisive factor of negative image: technology. If is the screen printing process or dry film process, the film pellicle surface substrate surface for copper. If it is exposed by diazo film, the diazo film copy image, so the image for the film pellicle surface with substrate surface of copper. If the light when plotted as a unit rather than the imposition in the film, light painting film, is more a mirror.
2, determine the parameters of solder extension.
Determination principle:
You can't reveal the wire next to the pad.
Small can not cover the pad.
Due to the operation error, the solder resist diagram may cause deviation to the line. If the solder resist is too small, the offset result may cause the edge of the pad to be covered. Therefore, resistance welding should be larger. But if the solder resist expands too much, the conductor may be exposed due to the influence of the deviation.
According to the above requirements, the decisive factor of resistance enlargement is:
The deviation value of the welding process position and the deviation value of the welding pattern.
Because the deviations caused by various processes are different, the welding resistance value of various processes is also increased
Different. The deviation of resistance welding big expansion value should be bigger.
The wire board density, distance between the pad and the solder wire, expand the value should be smaller; plate
The sub wire density is small, and the solder resist expansion value is larger.
3, according to whether the board has printed plug (commonly known as gold finger) to determine whether to process art line.
4, according to the requirements of electroplating process to determine whether to add conductive conductor for electroplating.
5, according to the hot air leveling (commonly known as tin spray) process requirements, determine whether to add conductive process line.
6, according to the drilling process to determine whether to add the central hole of the pad.
7, according to the subsequent process to determine whether to add process positioning hole.
8, according to the shape of the board to determine whether to add contour line.
9, when the user requires high precision board width accuracy is high, according to the production level of our factory, determine whether the line width correction, in order to adjust the influence of side corrosion.