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CAN interface and high-speed USB (HS USB) MiniHost and device with on-chip physical layer (PHY). Devices are available in
a dual-bank configuration of 256KB and 512KB Flash total and in 100-pin QFP and BGA package options. The architecture is
designed to support high-speed data transfers and includes a multi-layer bus matrix plus dual SRAM banks, direct memory
access (DMA) channels and peripheral DMA controller (PDC) for applications supporting multi-task operations. The SAM3A
series is ideal for networking applications in the industrial embedded market and in home and building automation,
smart grids and industrial automation.